Mobile real-time target machine - Ruggedness
The machine's enclosure is solid chromated aluminum with high EMI protection (CE, EN50081-2, EN50082-2, EN60950). The front and back plates are anodized aluminum. The enclosure has no holes for cooling. Cooling is accomplished entirely by conduction. The machine doesn't contain any mechanically moving parts like CPU fan or hard disk. The CPU and chipsets are cooled by conduction and instead of a hard disk an IDE FLASH device is used.
I/O module expansion is accomplished through the use of PMC I/O modules. The PMC modules get mounted onto a PMC carrier board which is itself mounted onto the mainboard. The mainboard and the PMC carrier board(s) form a rigid unit. Because the enclosure's I/O connectors are the PMC module connector no internal loose cabling is necessary. This leads to a very clean and rugged design. Overall this protects the machine against vibration and shock (EN60068-2-6 and EN60068-2-27).
The operating temperature range is 0ºC to 60ºC and optionally -40ºC to 75ºC.
Customer quote
"Up and running in less than a day!"
Darren Hartman,
HUSCO International
News
New I/O Expansion chassis with six additional PCI slots
(03-May-2010) Read more
New Quadrature Decoding FPGA code module complementing the PWM and CAP FPGA code modules
(27-Apr-2010)
Read more
New SPI and I2C FPGA-based configurable protocol support
(12-April-2010)
Read more
New Education real-time target machine for mechatronic designs
(01-Mar-2010)
Read more
Raw Ethernet, UDP, J1939, Arinc 429, MIL-STD-1553, Shared Memory, LVDT/ RVDT, and Synchro/ Resolver support (01-Jan-2010) Read more
xPC Target dual core and highest CPU clockrate support (3.33GHz) (04-Sep-2009) Read more
Newsletter subscription